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Thermoformed Circuit Boards: Fabrication of highly conductive freeform
  3D printed circuit boards with heat bending
v1v2 (latest)

Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending

International Conference on Human Factors in Computing Systems (CHI), 2020
12 November 2020
T. W. Hong
C. Myant
David E. Boyle
ArXiv (abs)PDFHTML

Papers citing "Thermoformed Circuit Boards: Fabrication of highly conductive freeform 3D printed circuit boards with heat bending"

4 / 4 papers shown
Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits
  with a Fiber Laser Engraver
Fibercuit: Prototyping High-Resolution Flexible and Kirigami Circuits with a Fiber Laser EngraverACM Symposium on User Interface Software and Technology (UIST), 2022
Zeyu Yan
Anup Sathya
Sahra Yusuf
Jyh-Ming Lien
Huaishu Peng
90
33
0
17 Aug 2022
Open5x: Accessible 5-axis 3D printing and conformal slicing
Open5x: Accessible 5-axis 3D printing and conformal slicing
F. Hong
S. Hodges
C. Myant
David E. Boyle
AI4CE
71
32
0
23 Feb 2022
InfoPrint: Embedding Information into 3D Printed Objects
InfoPrint: Embedding Information into 3D Printed Objects
Weiwei Jiang
Chaofan Wang
Zhanna Sarsenbayeva
Andrew Irlitti
Jarrod Knibbe
Tilman Dingler
Jorge Goncalves
V. Kostakos
WIGM
61
3
0
01 Dec 2021
Vacuum-formed 3D printed electronics: fabrication of thin, rigid and
  free-form interactive surfaces
Vacuum-formed 3D printed electronics: fabrication of thin, rigid and free-form interactive surfacesSN Computer Science (SN Comput. Sci.), 2021
F. Hong
Luca Tendera
C. Myant
David E. Boyle
AI4CE
94
16
0
26 Apr 2021
1
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